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刘学平

发布时间:2023-10-08

在国内外高水平学术期刊和会议上发表论文40余篇,被EI检索的10余篇。

[1] The Recycle Model of Printed Circuit Board and Its Economy Evaluation,2007 IEEE International Symposium on Electronics and the Environment, ISEE, 2007, p 106-111

[2] Study of Relations between Several Factors in Immersion SilverTechnique and Galvanic Attack Problem,2007 IEEE International Symposium on Electronics and the Environment, ISEE, 2007,p 202-205

[3] Recycling strategy and a recyclability assessment model based on an artificial neural network, JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, 129 (1-3): 500-506 OCT 11 2002

[4] The Quantification of the Relating Degree of Parts based on the Fuzzy Synthesizing Evaluation Method,2002 IEEE International Symposium on ELECTRONICS & the ENVIRONMENT, May 6-9,2002 San Francisco, CA, USA, 74-78

[5] Recycling and reuse of industrial wastes in manufacture stage of product life cycle, 6th International Conference on Progress of Machining Technology, Sept. 10-14, 2002, Xi’an, China, 993-997

[6] Green Design Assessing System Model of Products,2002 IEEE International Symposium On Electronics and the Environment(ISEE), San Francisco, California, 123-127

[7] ANN-Driven Fuzzy Reasoning Model of Product Green Attributes, Proceeding of the 3rd World Congress on Intelligent Control and Automation, 2000,7

[8] Life Cycle Assessment Tool For Electromechanical Products Green Design,2003 IEEE International Symposium on ELECTRONICS & the ENVIRONMENT, May 19-22, 2003 Boston, MA, USA

[9] An information system management of assessment of disassembly and recycle, 2003 IEEE International Symposium on ELECTRONICS & the ENVIRONMENT, May 19-22, 2003 Boston, MA, USA, 286-290

[10] INTELLIGENCE UDY OF CONTROL STRATEGY IN BGA REWORKROCESS. International Conference on Aanced Technology of Design and Manufacture 2010,90,426-430.

[11] 切削颤振模型及机理研究,机械工程学报 1998(4)

[12] 机电产品拆卸研究综述,机械工程学报,2004(7)


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