Liu Xueping

1995.9-2000.10, Dept. of Mechanical Engineering, Hefei University of Technology, Ph.D.

2003.10-now: Associate Professor, Advanced Manufacturing, Graduate School at Shenzhen, Tsinghua University, China

    Green Manufacturing and Intelligent Manufacturing; Recycling Tech. of E-wastes; Reverse Logistics

• The Key Technologies R&D Program of China: Technology Development for End-of-Life Electronic Product

• National High-tech R&D Program of China (863 Program): Green Attributes Assessment of Home Appliances and Recycling Technology of Waste Printed Circuit Board

• National High-tech R&D Program of China (863 Program): Study on Recycling Technology for E-wastes

1. The Recycle Model of Printed Circuit Board and Its Economy Evaluation，2007 IEEE International Symposium on Electronics and the Environment, ISEE, 2007, p 106-111

2. Study of Relations between Several Factors in Immersion SilverTechnique and Galvanic Attack Problem，2007 IEEE International Symposium on Electronics and the Environment, ISEE, 2007，p 202-205

3. Recycling strategy and a recyclability assessment model based on an artificial neural network, JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, 129 (1-3): 500-506 OCT 11 2002

4. The Quantification of the Relating Degree of Parts based on the Fuzzy Synthesizing Evaluation Method，2002 IEEE International Symposium on ELECTRONICS & the ENVIRONMENT, May 6-9,2002 San Francisco, CA, USA, 74-78

5. Recycling and reuse of industrial wastes in manufacture stage of product life cycle, 6th International Conference on Progress of Machining Technology, Sept. 10-14, 2002, Xi’an, China, 993-997

6. Green Design Assessing System Model of Products，2002 IEEE International Symposium On Electronics and the Environment(ISEE), San Francisco, California, 123-127

7. ANN-Driven Fuzzy Reasoning Model of Product Green Attributes, Proceeding of the 3rd World Congress on Intelligent Control and Automation, 2000,7

8. Life Cycle Assessment Tool For Electromechanical Products Green Design，2003 IEEE International Symposium on ELECTRONICS & the ENVIRONMENT, May 19-22, 2003 Boston, MA, USA

9. An information system management of assessment of disassembly and recycle, 2003 IEEE International Symposium on ELECTRONICS & the ENVIRONMENT, May 19-22, 2003 Boston, MA, USA, 286-290

10. INTELLIGENCE STUDY OF CONTROL STRATEGY IN BGA REWORKROCESS. International Conference on Aanced Technology of Design and Manufacture 2010,90,426-430.

The First Prize of Sichuan province Science and Technology Progress Award

The First Prize of China Association of Circular Economy Science and Technology Progress Award